Technician / Technical Operator (Optical)
Posted on Oct 7, 2024 by Halo Industries, Inc.
Santa Clara, CA
Engineering
Immediate Start
Annual Salary
Full-Time
The Primary Function of Position
The primary function for the Technician/Technical Operator, is the operation of various semiconductor wafer slicing and processing equipment, meeting quality and productivity goals, within a high volume, production manufacturing work environment.
This person would work closely with fellow team members, the lead for the area, and the manufacturing supervisor to achieve team performance goals in the areas of Efficiency, Yield, Throughput, Cycle Time, Scrap, Inventory Accuracy, and Time Lost Accuracy. Goals are set in each of these areas for each quarter and overall team performance is measured against them.
Requirements
Position Responsibilities
● Operate and set up (as needed), production wafer slicing and processing equipment with ability to multitask by working on several pieces of equipment.
● Become trained and proficient at multiple manufacturing processes while meeting requirements for workmanship, safety and productivity.
● Handle a variety of operations, including troubleshooting and rework, requiring a sufficient understanding of the functional operation of multiple processing stations, as well as the finished product.
● Perform inspection of one's own and other’s work. Perform simple repairs on own or other’s work.
● Mentor others in areas of expertise (as needed).
● Properly complete manufacturing documentation. Initiate basic material requests, report quality issues, report efficiency, record measurements as needed. May report work order information into the computer.
● Perform preparation work such as line clearance and changeover.
● Identify discrepant materials/components verbally and in writing.
● Maintain the accuracy of identification and count of point-of-use materials. Accurately determine and report material shortages.
● Follow all corporate, regulatory, safety and production policies and procedures.
● Maintain an excellent attendance record.
● Perform other duties as assigned.
● Escalate build issues through the proper channels and drive to resolution.
● Coach and effectively lead new technicians on builds when multiple technicians are required to complete projects.
● Be comfortable with working long hours when required to achieve deadlines.
General Position Requirements
● Minimum High school diploma or equivalent military training, technical diploma, or equivalent experience, with an Associates degree in a technical field preferred.
● Must have a minimum 1-2 years of work experience, in an environment where consistently following detailed instructions is a must.
● Willing to learn / acquire knowledge in the field of wafer fabrication to advance technical skillset.
● High level of craftsmanship and attention to detail married with the ability to work quickly.
● Quality focused with the ability to manage your time across multiple competing tasks and priorities.
● Able to lift 30-50 pounds on a daily basis and to maintain a safe working environment.
● Have an aptitude for problem solving
● The willingness to work overtime as needed or required
Benefits
Benefits
● Health Care Plan (Medical, Dental & Vision)
● Retirement Plan (401k, IRA)
● Paid time off (Vacation, Sick & Public Holidays)
● Family Leave (Maternity and Paternity)
● Stock Option Plan
The primary function for the Technician/Technical Operator, is the operation of various semiconductor wafer slicing and processing equipment, meeting quality and productivity goals, within a high volume, production manufacturing work environment.
This person would work closely with fellow team members, the lead for the area, and the manufacturing supervisor to achieve team performance goals in the areas of Efficiency, Yield, Throughput, Cycle Time, Scrap, Inventory Accuracy, and Time Lost Accuracy. Goals are set in each of these areas for each quarter and overall team performance is measured against them.
Requirements
Position Responsibilities
● Operate and set up (as needed), production wafer slicing and processing equipment with ability to multitask by working on several pieces of equipment.
● Become trained and proficient at multiple manufacturing processes while meeting requirements for workmanship, safety and productivity.
● Handle a variety of operations, including troubleshooting and rework, requiring a sufficient understanding of the functional operation of multiple processing stations, as well as the finished product.
● Perform inspection of one's own and other’s work. Perform simple repairs on own or other’s work.
● Mentor others in areas of expertise (as needed).
● Properly complete manufacturing documentation. Initiate basic material requests, report quality issues, report efficiency, record measurements as needed. May report work order information into the computer.
● Perform preparation work such as line clearance and changeover.
● Identify discrepant materials/components verbally and in writing.
● Maintain the accuracy of identification and count of point-of-use materials. Accurately determine and report material shortages.
● Follow all corporate, regulatory, safety and production policies and procedures.
● Maintain an excellent attendance record.
● Perform other duties as assigned.
● Escalate build issues through the proper channels and drive to resolution.
● Coach and effectively lead new technicians on builds when multiple technicians are required to complete projects.
● Be comfortable with working long hours when required to achieve deadlines.
General Position Requirements
● Minimum High school diploma or equivalent military training, technical diploma, or equivalent experience, with an Associates degree in a technical field preferred.
● Must have a minimum 1-2 years of work experience, in an environment where consistently following detailed instructions is a must.
● Willing to learn / acquire knowledge in the field of wafer fabrication to advance technical skillset.
● High level of craftsmanship and attention to detail married with the ability to work quickly.
● Quality focused with the ability to manage your time across multiple competing tasks and priorities.
● Able to lift 30-50 pounds on a daily basis and to maintain a safe working environment.
● Have an aptitude for problem solving
● The willingness to work overtime as needed or required
Benefits
Benefits
● Health Care Plan (Medical, Dental & Vision)
● Retirement Plan (401k, IRA)
● Paid time off (Vacation, Sick & Public Holidays)
● Family Leave (Maternity and Paternity)
● Stock Option Plan
Reference: 203522147
https://jobs.careeraddict.com/post/96009079
Technician / Technical Operator (Optical)
Posted on Oct 7, 2024 by Halo Industries, Inc.
Santa Clara, CA
Engineering
Immediate Start
Annual Salary
Full-Time
The Primary Function of Position
The primary function for the Technician/Technical Operator, is the operation of various semiconductor wafer slicing and processing equipment, meeting quality and productivity goals, within a high volume, production manufacturing work environment.
This person would work closely with fellow team members, the lead for the area, and the manufacturing supervisor to achieve team performance goals in the areas of Efficiency, Yield, Throughput, Cycle Time, Scrap, Inventory Accuracy, and Time Lost Accuracy. Goals are set in each of these areas for each quarter and overall team performance is measured against them.
Requirements
Position Responsibilities
● Operate and set up (as needed), production wafer slicing and processing equipment with ability to multitask by working on several pieces of equipment.
● Become trained and proficient at multiple manufacturing processes while meeting requirements for workmanship, safety and productivity.
● Handle a variety of operations, including troubleshooting and rework, requiring a sufficient understanding of the functional operation of multiple processing stations, as well as the finished product.
● Perform inspection of one's own and other’s work. Perform simple repairs on own or other’s work.
● Mentor others in areas of expertise (as needed).
● Properly complete manufacturing documentation. Initiate basic material requests, report quality issues, report efficiency, record measurements as needed. May report work order information into the computer.
● Perform preparation work such as line clearance and changeover.
● Identify discrepant materials/components verbally and in writing.
● Maintain the accuracy of identification and count of point-of-use materials. Accurately determine and report material shortages.
● Follow all corporate, regulatory, safety and production policies and procedures.
● Maintain an excellent attendance record.
● Perform other duties as assigned.
● Escalate build issues through the proper channels and drive to resolution.
● Coach and effectively lead new technicians on builds when multiple technicians are required to complete projects.
● Be comfortable with working long hours when required to achieve deadlines.
General Position Requirements
● Minimum High school diploma or equivalent military training, technical diploma, or equivalent experience, with an Associates degree in a technical field preferred.
● Must have a minimum 1-2 years of work experience, in an environment where consistently following detailed instructions is a must.
● Willing to learn / acquire knowledge in the field of wafer fabrication to advance technical skillset.
● High level of craftsmanship and attention to detail married with the ability to work quickly.
● Quality focused with the ability to manage your time across multiple competing tasks and priorities.
● Able to lift 30-50 pounds on a daily basis and to maintain a safe working environment.
● Have an aptitude for problem solving
● The willingness to work overtime as needed or required
Benefits
Benefits
● Health Care Plan (Medical, Dental & Vision)
● Retirement Plan (401k, IRA)
● Paid time off (Vacation, Sick & Public Holidays)
● Family Leave (Maternity and Paternity)
● Stock Option Plan
The primary function for the Technician/Technical Operator, is the operation of various semiconductor wafer slicing and processing equipment, meeting quality and productivity goals, within a high volume, production manufacturing work environment.
This person would work closely with fellow team members, the lead for the area, and the manufacturing supervisor to achieve team performance goals in the areas of Efficiency, Yield, Throughput, Cycle Time, Scrap, Inventory Accuracy, and Time Lost Accuracy. Goals are set in each of these areas for each quarter and overall team performance is measured against them.
Requirements
Position Responsibilities
● Operate and set up (as needed), production wafer slicing and processing equipment with ability to multitask by working on several pieces of equipment.
● Become trained and proficient at multiple manufacturing processes while meeting requirements for workmanship, safety and productivity.
● Handle a variety of operations, including troubleshooting and rework, requiring a sufficient understanding of the functional operation of multiple processing stations, as well as the finished product.
● Perform inspection of one's own and other’s work. Perform simple repairs on own or other’s work.
● Mentor others in areas of expertise (as needed).
● Properly complete manufacturing documentation. Initiate basic material requests, report quality issues, report efficiency, record measurements as needed. May report work order information into the computer.
● Perform preparation work such as line clearance and changeover.
● Identify discrepant materials/components verbally and in writing.
● Maintain the accuracy of identification and count of point-of-use materials. Accurately determine and report material shortages.
● Follow all corporate, regulatory, safety and production policies and procedures.
● Maintain an excellent attendance record.
● Perform other duties as assigned.
● Escalate build issues through the proper channels and drive to resolution.
● Coach and effectively lead new technicians on builds when multiple technicians are required to complete projects.
● Be comfortable with working long hours when required to achieve deadlines.
General Position Requirements
● Minimum High school diploma or equivalent military training, technical diploma, or equivalent experience, with an Associates degree in a technical field preferred.
● Must have a minimum 1-2 years of work experience, in an environment where consistently following detailed instructions is a must.
● Willing to learn / acquire knowledge in the field of wafer fabrication to advance technical skillset.
● High level of craftsmanship and attention to detail married with the ability to work quickly.
● Quality focused with the ability to manage your time across multiple competing tasks and priorities.
● Able to lift 30-50 pounds on a daily basis and to maintain a safe working environment.
● Have an aptitude for problem solving
● The willingness to work overtime as needed or required
Benefits
Benefits
● Health Care Plan (Medical, Dental & Vision)
● Retirement Plan (401k, IRA)
● Paid time off (Vacation, Sick & Public Holidays)
● Family Leave (Maternity and Paternity)
● Stock Option Plan
Reference: 203522147
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