CareerAddict

Senior Packaging Engineer

CV-Library

Posted on Jul 13, 2026 by CV-Library
King's Cross, Greater London, United Kingdom
Engineering
Immediate Start
£130k - £150k Annual
Full-Time
Senior / Staff Packaging Engineer

London (Hybrid)

My client is an innovative AI hardware startup developing next-generation computing technology designed to revolutionise AI infrastructure. They're looking for an experienced Packaging Engineer to help bridge the gap between cutting-edge silicon and high-performance products, working on advanced semiconductor technologies alongside a world-class engineering team.

Role Requirements:

*

Lead the development of advanced semiconductor packaging solutions from concept through to production

*

Design and optimise package, substrate and system-level integration for high-performance devices

*

Work across package architecture, layout, simulation and product development activities

*

Collaborate with ASIC, hardware and systems engineers to deliver innovative packaging solutions

Key Skills Required:

*

Experience in semiconductor packaging or advanced electronic packaging

*

Knowledge of package, substrate or PCB design and integration

*

Experience using industry-standard package or PCB design tools

*

Understanding of signal integrity, power integrity or high-speed design principles

*

Experience working with multidisciplinary engineering teams throughout product development

If this sounds like you, please apply

Reference: 225361791

https://jobs.careeraddict.com/post/113548493
CV-Library

Senior Packaging Engineer

CV-Library

Posted on Jul 13, 2026 by CV-Library

Print
King's Cross, Greater London, United Kingdom
Engineering
Immediate Start
£130k - £150k Annual
Full-Time
Senior / Staff Packaging Engineer

London (Hybrid)

My client is an innovative AI hardware startup developing next-generation computing technology designed to revolutionise AI infrastructure. They're looking for an experienced Packaging Engineer to help bridge the gap between cutting-edge silicon and high-performance products, working on advanced semiconductor technologies alongside a world-class engineering team.

Role Requirements:

*

Lead the development of advanced semiconductor packaging solutions from concept through to production

*

Design and optimise package, substrate and system-level integration for high-performance devices

*

Work across package architecture, layout, simulation and product development activities

*

Collaborate with ASIC, hardware and systems engineers to deliver innovative packaging solutions

Key Skills Required:

*

Experience in semiconductor packaging or advanced electronic packaging

*

Knowledge of package, substrate or PCB design and integration

*

Experience using industry-standard package or PCB design tools

*

Understanding of signal integrity, power integrity or high-speed design principles

*

Experience working with multidisciplinary engineering teams throughout product development

If this sounds like you, please apply
Print

Reference: 225361791

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