3D Image Sensing Technology Expert
Posted on Sep 17, 2019 by Nexere Consulting Limited
The responsibility includes:
- Participate in the pixel design of the 3D image sensor chip and develop the process according to the design, interface with the Fab side process team and participate in the daily work planning, and assist in the process integration to introduce the mass production.
- Has many years of experience in image sensor chip product development; has the ability to expand and manage the team.
- Excellent knowledge on TCAD simulation or TOF system modelling/simulation.
- Actively develop new process technologies and methods to enhance the core indicators of 3D image sensing arrays, including quantum efficiency improvement, dark current reduction, and reduction of inter-pixel interference.
Required Education and Experience:
- Master/PhD required
- Minimum +8 years of work experience in the area
- Has many experience in mass production of image sensor chip products; solves the design or engineering problems in the process from sample to mass production.