Assembly Support Engineer (flipchip, wirebonding, SMT processes)

Initial 12 month contract + option to extend

Leuven, Belgium

Support & coordinate assembly engineering related activities to suppliers/subcontractors to make sure that assembled devices will have no issue and is delivered in time.

The assignment

• Lead the development and implementation of flipchip, wirebonding, and SMT assembly processes to meet quality, cost, and delivery targets.
• Collaborate with cross-functional teams, including R&D, Manufacturing, and Quality Assurance, to drive new product and resolve assembly-related issues.
• Conduct process characterization and optimization studies to improve yield, efficiency, and reliability.
• Provide technical expertise and guidance on assembly processes.
• Maintain documentation, including work instructions, and process specifications

Required knowledge and skills

• Minimum 5 years of experience in assembly engineering, with a focus on flipchip, wirebonding, and SMT processes in a semiconductor or electronics manufacturing environment.
• Proficiency in using assembly equipment such as wire bonders, flipchip bonders, and SMT placement machines.
• Strong understanding of assembly materials, including solder, adhesives, and underfills.
• Experience with statistical analysis tools and methodologies for process optimization (eg, Design of Experiments, Statistical Process Control).
• Excellent problem-solving skills and the ability to troubleshoot complex assembly issues.